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bga x ray inspection system

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Качество 1.6kW автономное программируя Unicomp x Рэй AX9100 для соединителя Фабрика

1.6kW автономное программируя Unicomp x Рэй AX9100 для соединителя

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Offline programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Качество Машина АС7900 Рэй цифров в реальном времени для осмотра внутренних дефектов ПКБА Фабрика

Машина АС7900 Рэй цифров в реальном времени для осмотра внутренних дефектов ПКБА

Unicomp factory supply quality control X-ray inspection machine for SMT industry APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC

Качество Microfocus закрыло трубку Unicomp x Рэй 130kV 3um для паять SMT BGA Фабрика

Microfocus закрыло трубку Unicomp x Рэй 130kV 3um для паять SMT BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnificati

Качество машина AX9100 трубки x Рэй 3µM Microfocus для CSP EMS BGA Фабрика

машина AX9100 трубки x Рэй 3µM Microfocus для CSP EMS BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Качество Детектор Unicomp x Рэй 0.8KW FPD оси z для автозапчастей Фабрика

Детектор Unicomp x Рэй 0.8KW FPD оси z для автозапчастей

Using Unicomp X-ray inspection machine for medical indwelling needle inside quality measurement Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area

Качество Машина микро- БГА осмотра обломока встречная БГА кс Рэй на анализе отбивной котлеты Фабрика

Машина микро- БГА осмотра обломока встречная БГА кс Рэй на анализе отбивной котлеты

Chip Counter BGA X Ray Inspection Machine Micro BGA on chop analysis​ X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to

Качество Unicomp в реальном времени x Рэй 1.6kW AX9100 для собрания электроники Фабрика

Unicomp в реальном времени x Рэй 1.6kW AX9100 для собрания электроники

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power

Качество подсвечиватель 130kV 3um Microfocus x Рэй FPD для алюминиевый паять PCBA Фабрика

подсвечиватель 130kV 3um Microfocus x Рэй FPD для алюминиевый паять PCBA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Качество Увеличение 5μm системы рванины 1000X Адвокатур СИД Unicomp x Рэй детектора FPD Фабрика

Увеличение 5μm системы рванины 1000X Адвокатур СИД Unicomp x Рэй детектора FPD

Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● 100KV 5μm X-Ray tube. ● FPD Detector. ● Real-time image. ● 1000X system magnification. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. ● Modular design with In-line expansibility. ● Economical and Practical. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta