bga x ray machine
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130КВ микрофокусный точечный рентгеновский аппарат Unicomp AX9100 модернизированная модель AX9100MAX с двойными компьютерами для проверки PCB&BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Детектор фотодиода x Рэй блока развертки 40AWG безопасностью высокой эффективности BGA x Рэй
Metro Museum Expo Center Security X-Ray Scanner Machine UNX6040E The UNX Series X-ray security detection machine release is a dynamic project associated with our Unicomp Technology Research and Development Manufacturing Division. Our full range of security machines are designed to address multiple safety requirements including internal detection of luggage, backpacks and express courier packages. The UNX Series machines are also effective for port logistics transportation,
Машина 100kv самостоятельно x Рэй 5KW AX8800 стойки для плиты Aligenment
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Features: ● Off-line lithium battery detection equipment ● 100KV 5μm closed X-ray tube, Hi-resolution detector ● X-ray tube and detector can be programmed to move to Z Axis ● Automatic control of all the moving parts, Automatic programming ● Convenient target point positioning system ● Automation software judgments detection Applications: ●Lithium battery pole piece solder joint defect detection, ●Lithium
Автономная машина 100kv AX8800 ISO9001 батареи лития x Рэй
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: ● Lithium battery pole piece solder joint defect detection, ● Lithium battery batteries coiling case detection, ● BGA , CSP , LED , Flip Chip , Semiconductor, ● Battery Industry , Small Metal Casting, ● Electronic Connector Module, ● Aerospace Components , Photovoltaic Industry , ● Other Special Industries. Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø
Машина детектора x Рэй Unicomp AX8200max FPD для EMS SMT PCBA QFP
CHINA Leading X-ray manufacturer Unicomp AX8200max machine for EMS SMT PCBA QFP IC SOT package reflow Soldering Void Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
Манипулятор оси машины 6 Unicomp AX8200Max x Рэй для осмотра CNC Programmable
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
Размер точки фокусировки микронов рентгеновской машины SMT PCB для измерения пустоты BGA и проверки высоты подъема сварщика
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
SMT PCB рентгеновская машина Unicomp AX9100MAX высокое разрешение микронов фокусные точки размер для BGA пустоты и сварки пасты инспекции
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
Высокие спецификации электронные платы 2D & 2.5D рентгеновская машина Unicomp AX9100MAX с 360 градусов вращающейся таблицы для BGA и PCB инспекции
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
