electronics x ray system
"
Манипулятор оси машины 6 Unicomp AX8200Max x Рэй для осмотра CNC Programmable
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
машина Unicomp AX8200MAX блока развертки 5um 90kV x Рэй для свободных пространств SMT BGA QFN
90kV 5um microfocus Xray machine Unicomp AX8200MAX for SMT BGA QFN voids measurement with automatic inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
CE/FDA Certified Unicomp 110KV 5μm источник рентгеновского излучения для проверки качества IC
CE/FDA Certificated Unicomp 110KV 5μm X Ray Source to check IC Quality Key Parameter: Max. Tube Voltage: 110kV Max. Tube Power: 25W Beam Angle: 110±3° Min. Spot Size: ≤5μm Beam Angle: 110±3° Applications: SMT, PCBA ,Electronic Manufacturing Integrated Circuit Package IGBT Substrate / Module EV Battery Specifications: Operating Tube Voltage Range 40-110 kV Operating Tube Current Range 0-250 μA Maximum Tube Power 25W Input Voltage (DC) 25±0.5V Power Consumption ＜75W Window
100% отечественное сырье Unicomp микрофокус рентгеновский источник для точной проверки
100% Domestic Raw Material Unicomp Microfocus X Ray Source Key Parameter: Max. Tube Power: 25W Max. Tube Voltage: 110kV Beam Angle: 110±3° Beam Angle: 110±3° Min. Spot Size: ≤5μm Applications: Integrated Circuit Package SMT, PCBA ,Electronic Manufacturing EV Battery IGBT Substrate / Module Specifications: Operating Tube Voltage Range 40-110 kV Operating Tube Current Range 0-250 μA Maximum Tube Power 25W Input Voltage (DC) 25±0.5V Power Consumption ＜75W Window Material
Рентгеновская система AX9100max с алгоритмами восстановления изображения сверхвысокой четкости
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Размер точки фокусировки микронов рентгеновской машины SMT PCB для измерения пустоты BGA и проверки высоты подъема сварщика
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
130KV микронов фокус точка размера рентгеновской машины трубы AX9100MAX с двойными компьютерами для проверки PCB&BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Измерение искривления IC Unicomp AX9100MAX рентгеновская машина с размером пикселей 84μm и углом наклона 60°
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
SMT PCB рентгеновская машина Unicomp AX9100MAX высокое разрешение микронов фокусные точки размер для BGA пустоты и сварки пасты инспекции
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
