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x ray detection systems

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Качество Оборудование NDT Unicomp x Рэй рентгенографирования для труб сваривая испытывать отказа Фабрика

Оборудование NDT Unicomp x Рэй рентгенографирования для труб сваривая испытывать отказа

Unicomp Riadiography NDT X-Ray inspection systems for pipes welding crack testing Applications: ● Cast parts and pressure Vessels ● Steel pipe,Cylinder and Wood ● Epoxy Resin Defect Detection ● Wheel,Tires and Metal parts Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development

Качество 1.6kW автономное программируя Unicomp x Рэй AX9100 для соединителя Фабрика

1.6kW автономное программируя Unicomp x Рэй AX9100 для соединителя

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Offline programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Качество Отображение Unicomp x Рэй 130kV CNC Microfocus AX9100 для материнской платы Фабрика

Отображение Unicomp x Рэй 130kV CNC Microfocus AX9100 для материнской платы

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Качество 3um закрыло машину трубки 1.6kW x Рэй для SMT BGA CSP Фабрика

3um закрыло машину трубки 1.6kW x Рэй для SMT BGA CSP

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,

Качество Microfocus закрыло трубку Unicomp x Рэй 130kV 3um для паять SMT BGA Фабрика

Microfocus закрыло трубку Unicomp x Рэй 130kV 3um для паять SMT BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnificati

Качество Система контроля 130kV 3um Unicomp Microfocus x Рэй для изображения FPD Фабрика

Система контроля 130kV 3um Unicomp Microfocus x Рэй для изображения FPD

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power

Качество Unicomp в реальном времени x Рэй 1.6kW AX9100 для собрания электроники Фабрика

Unicomp в реальном времени x Рэй 1.6kW AX9100 для собрания электроники

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power

Качество Система контроля 130KV BGA QFN Unicomp x Рэй с движением 6 осей Фабрика

Система контроля 130KV BGA QFN Unicomp x Рэй с движением 6 осей

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Качество машина AX9100 трубки x Рэй 3µM Microfocus для CSP EMS BGA Фабрика

машина AX9100 трубки x Рэй 3µM Microfocus для CSP EMS BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage