x ray metal inspection
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Машина кс Рэй анализа побочной примеси промышленная для теста побочной примеси еды
Foreign Matter Analysis Industrial x ray machine for food foreign matter test Appilcation : Features: Excellent operability: Automatically save product images, convenient for later analysis. Adapt to multiple product inspection: Pallets, bags, boxes, bottles, cans, loose products etc. High specification hardware configuration: The components of the equipment are imported brands to ensure the performance and service life of the whole machine. Easy to disassemble and clean:
Детектор рванины Unicomp NDT x Рэй оборудования осмотра 2.5KVA x Рэй
Unicomp Portable NDT X-Ray Flaw Detector, X Ray Inspection for Welding / Foundry Quality Checking Except 250kV Panoramic X-Ray, Unicomp also supply 160kV, 200kV, 300kV, 350kV portable directional / panoramic X-Rays. Specifications: Output voltage: 150～250kV Tube current: 2~5mA Focus Size: 1.0×2.2mm Radiation angle: 360°*25° Photographic density: D＞1.5 Maximum penetrating power : 35mm(A3 Steel) Generator Dimension: 220mm*740 mm Controller Dimension: 370mm*300mm*150 mm Power: 2
Передвижной рентгеновский аппарат microfocus Unicomp AX8200MAX 5um для осмотра дефектов EMS автомобильного PCBA BGA QFN CSP паяя
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Машина 22" осмотра высокой точности кс Рэй применение электронной промышленности монитора ЛКД
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
система обнаружения ADR машины последовательно x Рэй СИД 3.5kW Адвокатуры для внутреннего качественного осмотра
LED bar Inline X-Ray ADR Detection System for Inside Quality Inspection Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Системы контроля электроники BGA x Рэй дефекта конденсатора измерять внутренней автоматический
Capacitor Inner Defect Inspection with Electronics X-ray 100 KV Power AX8200MAX Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic
FPD загерметизировало CNC осмотра Pcb x Рэй конденсатора 100KV Programmable
FPD 100KV X Ray Inspection System For Capacitor Function & Features Large Size Inspection Table Laser Locator for Precise Location 24’’ FHD Interactive Touch LCD Display Accurate Control, CNC ProgrammingAutomatic Positioning FPD 60° Tilting Inspection Fingerprint Access Management System Real-time Monitoring of Radiation Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic
Оборудования осмотра дефектов x Рэй конденсатора фокус внутреннего микро- электронный
Micro Focus Electronics X Ray System For Capacitor Internal Defects Control Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features Fingerprint Access Management System Real-time Monitoring of Radiation 24’’ FHD Interactive Touch LCD Display Large Size Inspection Table Laser Locator for
90kV закрыло систему трубки 0.8kW x Рэй для паять СИД SMT
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
