Машина электроники кс Рэй
SMT PCB рентгеновская машина Unicomp AX9100MAX высокое разрешение микронов фокусные точки размер для BGA пустоты и сварки пасты инспекции
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary ...
Электронные платы 2D & 2.5D рентгеновская машина AX9100MAX с 360-градусным вращающимся столом для BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
130KV микронов фокус точка размера рентгеновской машины трубы AX9100MAX с двойными компьютерами для проверки PCB&BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
Программируемая автоматическая проверка с помощью ЧПУ Электронная рентгеновская машина AX9100MAX с углом наклона 60° для измерения кривизны IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
Высокоувеличенная рентгеновская машина для печатных плат Unicomp AX9100MAX для проверки проволоки склеивания компонентов электроники IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
Рентгеновская система AX9100max с алгоритмами восстановления изображения сверхвысокой четкости
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
AX9100max Электронная рентгеновская машина с фиксированной точкой следования при наклоне FPD
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
Рентгеновская система Unicomp AX9100max для проверки внутренних дефектов электронных компонентов
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
130КВ микрофокусный точечный рентгеновский аппарат Unicomp AX9100 модернизированная модель AX9100MAX с двойными компьютерами для проверки PCB&BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary ...
