Машина электроники кс Рэй
Высокая система электроники кс Рэй увеличения для осмотра свободного пространства БГА КСП/КФН/ПоП
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area ...
2.5Д озаглавливая вращение 360° машины 40В электроники кс Рэй с движением 6 осей
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation ...
Оборудование 22" осмотра кс Рэй БГА ЛКД с функцией обнаружения КНК Программабле
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC ...
Машина электроники кс Рэй высокой эффективности, машина ПКБ кс Рэй СМТ с монитором Лкд 22 дюймов
Electronics X Ray Machine SMT BGA X-ray Detection Equipment for PCB X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ...
Осмотр блока развертки безопасностью CSP 130kV x Рэй автоматический для керамического NDT
130kV clsoed tube X-ray system with convenient mapping process for ceramic NDT quality testing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)...
CNC оборудования LX2000 BGA QFN CSP x Рэй Programmable для паять FPC SMT
LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood ...
Анализировать встроенную машину LX2000 FPC электроники x Рэй SPC для паять BGA QFN
Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood ...
Режим контроля КНК обнаружения рванины свободного пространства системы электроники кс Рэй прокладки СИД паяя
LED Strip Soldering Quality / Void Flaw Detection X-Ray Machine Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier ...
система обнаружения ADR машины последовательно x Рэй СИД 3.5kW Адвокатуры для внутреннего качественного осмотра
LED bar Inline X-Ray ADR Detection System for Inside Quality Inspection Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System ...
