Рентгеновский сканер безопасности

Unicomp UNCT3200 High-Resolution 450KV 3D CT System for engine blades Castings porosity analysis NDT Quality Inspection For Precision Turbine Blade Porosity Analysis Product Specifications Attribute Value Maximum tube voltage 450kV Focal size (EN 12543) d=0.4mm/d=1.0mm Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing machine features a vertical twin-column design with a high-precision, solid marble base. Equipped with

Unicomp UNCT2600 Industrial 225KV 3D Computed Tomography System NDT Quality Inspection Product Description: UNCT2600 is a highly sophisticated, compact industrial CT inspection system that can be used in a variety of sizes with materials, to meet the high precision inspection needs of different industries. Mainly used in small metal castings and colored metal, lithium new energy battery cells, chips, electronic devices, rock samples, core, soil, chemical stone, composite

Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection Description of BGA X-Ray machine AX7900: Equipped with 90kV / 5μm micro-focus X-ray tube and high-performance FPD detector, AX7900 adopts a multifunctional workstation design. It features standard XY multi-axis motion with optional ±60° tilt. Independent Z-axis movement of X-ray tube and FPD allows flexible adjustment of magnification and FOV. Integrated with target positioning system and professional DXI

Unicomp Self-developed Software with Anti-interference Counting Algorithm CX7000L Chip Counter Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 870 mm*1410 mm*1960 mm / 740 kg Package Plywood Case, 1050 cm*1650 cm*2200 cm, Total 920 kg Power Consumption 700W Power Supply 220V ±10% 50Hz/60Hz 3A System Computer Operating System Industrial PC, Windows11 RAM CPU Model 16G/I5 8 generation Monitor 27” FHD LCD Display X- R ay Tube Max. Voltage 80 kV

UNCT2100 UNICOMP High-Precision Desktop CT Safe Protection Electronics Composites Xray Inspection System Product Description: The UNCT2100 is a high-precision compact desktop industrial CT inspection system by UNICOMP, specialized in small workpiece non-destructive testing. It has 8μm focal spot, 110kV X-ray tube, supports DR&CT dual imaging and 3D analysis. With radiation dose below national standards, user-friendly control and 10kg loading capacity, it’s widely used for

Dual CT Imaging Ultra Low Radiation Electronics Composite X-ray Inspection Machine UNCT2600 UNICOMP Product Description: UNCT2600 is a high-precision compact industrial CT system, engineered for multi-specification and multi-material workpiece inspection to meet sophisticated nondestructive testing demands across diverse industries. It is widely applicable to precision inspection of small metal castings, non-ferrous metals, lithium battery cells, semiconductor chips,

160kV High Efficiency Digital Radiography X-ray Inspection Equipment for Metal Plastic Ceramic UNC160 Unicomp Detection purpose: Metal castings, hardware products, plasticproducts, refractory materials, review materials, ceramic body and metalparts welding and other products for non-destructive. System Parameters Dimensions 2024mm*2160mm*2292mm(L*W*H) Equipment weight 3.2T Power Consumption 6KW Power Supply 380AC/50Hz X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube

High Resolution Defect Detection Reliable IC Internal Inspection PCBA IC X-ray AX9600 Unicomp Equipped with UNICOMP’s independently developed 160kV high-power open micro-focus X-ray tube, the AX9600 achieves an ultra-fine focal spot of 0.8μm. Combined with 2000× ultra-high optical magnification and superior X-ray penetration performance, it enables high-accuracy void fraction testing for TVS diodes. It is specially optimized for high-precision non-destructive inspection of

Clear Imaging BGA Void Detection PCBA BGA X-ray AX9600 Unicomp SMT PCB Assembly Inspection System UNICOMP AX9600 adopts an in-house developed 160kV high-power open micro-focus X-ray tube with an ultra-fine 0.8μm focal spot. It supports magnification up to 2000× and offers superior X-ray penetration, enabling precise void content measurement for TVS diodes. Optimized for high-end semiconductor inspection, it caters to high-precision quality control of advanced IC packaging,