Рентгеновский сканер безопасности
Unicomp AX9600 160KV Открытая трубка 2.5D рентгеновский аппарат для высокоточных TVS диодов
Unicomp High-end Semiconductor X-Ray Inspection System AX9600 UNICOMP AX9600 features a self-developed 160kV high-power open micro-focus X-ray tube, delivering an ultra-small 0.8μm focal spot. With exceptional magnification up to 2000 times and outstanding ray penetration capacity, it accurately measures void ratio of TVS diodes, and is ideal for high-precision quality inspection of advanced IC packaging, HBM memory chips and GPU semiconductor components. Specifications:
Высокоточная прецизионность движения 90кВ герметичная трубка MOSFET полупроводниковый компонент рентгеновское оборудование AX7900 Unicomp контроль качества
Electronic Semiconductor X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is an advanced micro-focus X-ray NDT system manufactured by UNICOMP Technology.It delivers ultra-clear internal defect imaging for semiconductor packaging, SMT assembly and electronic component quality inspection.Adopting independently manufactured X-ray tubes and professional image analysis software, it effectively inspects solder voids, welding defects, PCB internal layers, battery cells and precision
Электронный рентгеновский инспекционный аппарат AX7900 Unicomp 5 мкм Микрофокус Автоматическое обнаружение пустот BGA припой Высокая точность
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
