Brief: Curious about how the Unicomp LX9200 3D CT X-Ray machine enhances PCB BGA inspection? This video showcases its advanced inline inspection capabilities, 3D imaging, and real-time defect detection for SMT, semiconductors, and more.
Related Product Features:
The Unicomp LX9200 offers 2D, 2.5D, and 3D inline X-ray inspection in one system.
Features a 130KV closed micro-focus X-ray generator for high-resolution imaging.
Equipped with an HD FPD detector for real-time, clear inspection images.
Supports 11-axis linkage and 360° circular CT imaging for comprehensive analysis.
Designed for PCB BGA inspection with warpage compensation up to ±2mm.
Maximum inspection area of 610*1200mm for large PCBA components.
Includes data tracking and reworking system for efficient defect management.
Complies with safety standards with X-ray leakage below 0.5µSv/h.
ЧаВо:
What types of defects can the Unicomp LX9200 detect?
The LX9200 detects defects like voids, HIP, insufficient solder, bridges in BGA/LGA packages, and opens/shorts in semiconductors.
What is the maximum inspection area for the LX9200?
The XL-size inspection area supports up to 610*1200mm, suitable for large PCBA components.
Does the LX9200 support 3D imaging?
Yes, it provides 2D, 2.5D, and 3D imaging with 360° circular CT for detailed internal inspections.