bga x ray inspection system
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Система контроля ФПД 90КВ кс Рэй для обнаружения дефекта ПКБА Уникомп АС7900
FPD 90KV X Ray Inspection System for PCBA defect Detection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption
Машина контроля качества кс Рэй Уникомп для индустрии СМТ
Unicomp factory supply quality control X-ray inspection machine for SMT industry APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
Машина AX7900 осмотра электронной промышленности x Рэй с высокой эффективностью
The Most Economic X-Ray inspection machine AX7900 with high performance Description of IC X Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
Оборудование осмотра FPD 90KV x Рэй для обнаружения дефектов проводки провода
FPD 90KV X Ray Inspection System for Wire Harness defects Detection Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
Система контроля FDP 90KV x Рэй для дефектов проводки провода обнаруживая китайский изготовитель
Chinese Manufacturer FDP 90KV X-ray Inspection System for Wire Harness Defects Detecting Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines.
Усовершенствованное рентгеновское оборудование для электронной промышленности 1000 кг максимальная нагрузка
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: Large Size Inspection Table,Laser Pinpoint For Precise Location Accurate Control, CNC Programming,Automatic Positioning FPD Tilting ±25° Safely Electromag
Машина AX9100 осмотра набора микросхем x Рэй материнской платы компьютера CE
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Система контроля 130kV 3um Unicomp Microfocus x Рэй для изображения FPD
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
Машина 1.6kW осмотра высокой точности x Рэй для алюминиевых отливок
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
