bga x ray inspection system
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Высокоточный 2,5D/3D рентгеновский контроль для обнаружения дефектов BGA и PCBA UNICOMP AX8300
High-Precision 2.5D/3D X-ray Inspection for BGA & PCBA Defect Detection UNICOMP AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In ...
Машина осмотра электронных блоков БГА кс Рэй
Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more ...
Полупроводниковый BGA флип-чип, рентгеновский контроль AX8300 UNICOMP, контроль доступа по отпечаткам пальцев
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
Система рентгенодефектоскопического контроля Бга материнской платы с дополнительной большой зоной осмотра
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, ...
Автономная система обработки изображений 65Вт машины ДСИ рентгеновского контроля Void BGA
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and ...
Полупроводниковый BGA флип-чип рентгеновского контроля AX8300MAX UNICOMP минимальное разрешение 5 мкм
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...
ПКБА паяя быстрый ход машины осмотра БГА кс Рэй с большой таблицей образца
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area 645*670mm, max. inspection area ...
Система контроля полупроводника СМТ Бга кс Рэй для внутреннего обнаружения дефектов
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
электроника Unicomp системы контроля 100kV PCBA x Рэй для свободного пространства/паять BGA
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification ...
