bga x ray inspection system
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Полупроводниковый BGA флип-чип, рентгеновский контроль AX8300 UNICOMP, контроль доступа по отпечаткам пальцев
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
Система рентгенодефектоскопического контроля Бга материнской платы с дополнительной большой зоной осмотра
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, ...
Стойте одна система 40В обработки изображений машины ДСИ осмотра свободного пространства БГА кс Рэй
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and ...
ПКБА паяя быстрый ход машины осмотра БГА кс Рэй с большой таблицей образца
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area φ570mm, max. inspection area ...
Система контроля полупроводника СМТ Бга кс Рэй для внутреннего обнаружения дефектов
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
Полупроводниковый BGA флип-чип рентгеновского контроля AX8300MAX UNICOMP минимальное разрешение 5 мкм
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...
электроника Unicomp системы контроля 100kV PCBA x Рэй для свободного пространства/паять BGA
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification ...
Подсвечиватель машины ФПД рабочего стола кс Рэй фокуса ПКБА микро-, охват рентгеновского снимка 48мм кс 54мм
Benchtop Electronics PCBA micro-focus BGA X Ray Inspection Machine OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to customers, with competitive price. 3.We provide one year warranty, free training and whole life technology support. 4.We can arrange the shipment by ...
Микро- машина AX7900 Unicomp x Рэй фокуса для осмотра SMT BGA Semicon IC
High Magnification cost effective Micro Focus X-ray machine AX7900 for SMT BGA and Semicon IC inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing ...
